Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure
US8282846B2 · kind B2 · utility
2Cited by
21References
20Claims
0Family size
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Inventor
Key dates
| Filing date | Feb 27, 2010 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Jan 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad, eliminates corrosion resulting from the anti-reflective layer being exposed to moisture during reliability testing by utilizing a side wall spacer in the opening that touches the side wall of the passivation layer, the side wall of the anti-reflective coating layer, and the top surface of the bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.