Rodney Hill
16Patents
5h-index
10Co-inventors
59Inventor score
Filing activity: Jun 27, 1996 → Feb 27, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7410879B1 | System and method for providing a dual via architecture for thin film resistors | Electricity | 22 | Expired |
| US7332403B1 | System and method for providing a buried thin film resistor having end caps defined by a dielectric mask | Electricity | 14 | Expired |
| US6920973B2 | Integrated reconfigurable manufacturing system | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7456097B1 | System and method for faceting via top corners to improve metal fill | Electricity | 6 | Expired |
| US6416676B1 | Deionized water degasification for semiconductor fabrication | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7829428B1 | Method for eliminating a mask layer during thin film resistor manufacturing | Electricity | 4 | Active |
| US7585775B1 | System and method for faceting a masking layer in a plasma etch to slope a feature edge | Electricity | 4 | Expired |
| US7808048B1 | System and method for providing a buried thin film resistor having end caps defined by a dielectric mask | Electricity | 3 | Active |
| US7291525B1 | System and method for manufacturing thin film resistors using a trench and chemical mechanical polishing | Electricity | 2 | Expired |
| US8282846B2 | Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure | Emerging Cross-Sectional Technologies | 2 | Active |
| US8679932B1 | System and method for manufacturing thin film resistors using a trench and chemical mechanical polishing | Electricity | 1 | Active |
| US7230517B1 | System and method for using plasma to adjust the resistance of thin film resistors | Electricity | 1 | Expired |
| US7544579B1 | System and method for faceting the corners of a resistor protect layer to reduce vertical step height | Electricity | 1 | Expired |
| US7875546B1 | System and method for preventing metal corrosion on bond pads | Electricity | 0 | Active |
| US7960240B1 | System and method for providing a dual via architecture for thin film resistors | Electricity | 0 | Active |
| US7982287B1 | System and method for faceting the corners of a resistor protect layer to reduce vertical step height | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.