Semiconductor assembly and multilayer wiring board
US8283570B2 · kind B2 · utility
4Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2008 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Aug 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor assembly includes a multilayer wiring board including at least three insulating layers, first, second and third insulating layers and a semiconductor device attached to one principal surface of the first insulating layer. The first, second and third insulating layers are stacked in this order. The multilayer wiring board further includes a heat-insulating member made of a material having a lower thermal conductivity than the insulating layers. The heat-insulating member is disposed between the first and second insulating layers or next to the first insulating layer at a side opposite to the one principal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.