Thin-wafer current sensors

US8283742B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Mario Motz · Wernberg, AT
• Udo Ausserlechner · Villach, AT

Key dates

• Filing date: Aug 31, 2010
• Grant date: Oct 9, 2012
• Expiry date: Jan 15, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before grinding (DBG) is utilized, which can improve reliability and minimize stress effects. While embodiments utilize face-up mounting, face-down mounting is made possible in other embodiments by via through -contacts. IC current sensor embodiments can present many advantages while minimizing drawbacks often associated with conventional IC current sensors.