Patent · US Active

Multi-die integrated circuit device and method

US8283771B2 · kind B2 · utility

6Cited by

4References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Dinesh Somasekhar · Hillsboro, US
Tanay Karnik · Portland, US
Jianping Xu · Portland, US
Yibin Ye · Portland, US

Key dates

Filing date	Jun 30, 2008
Grant date	Oct 9, 2012
Priority date	—
Expiry date	Mar 30, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In some embodiments, provided is an integrated circuit with a first die coupled to a second die. The second die has through-silicon vias disposed through it to provide power references to the first die. The through-silicon vias are laterally re-positionable without inhibiting circuit sections in the second die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.