Flip-flop semiconductor device packaging using bent leadfingers
US8283772B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | May 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling a semiconductor device, with a wire-bonded arrangement of conductive pads, in a face-up orientation beneath multiple bent leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the conductive pads of the device couple directly to the bent leadfingers, without requiring the manufacture of a new device or the rerouting of signal paths. Additionally, the flip-flop configuration provides convenient means for exposing surfaces of the device (e.g., to increase heat transfer therefrom, thermal performance of the device, etc.) and/or surfaces of the leadfingers (e.g., to provide test points, wire bondouts, etc.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.