Carlo Gamboa
5Patents
3h-index
3Co-inventors
39Inventor score
Filing activity: Apr 12, 2006 → May 27, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8436460B1 | Multiple die paddle leadframe and semiconductor device package | Electricity | 26 | Active |
| US8283772B1 | Flip-flop semiconductor device packaging using bent leadfingers | Electricity | 12 | Active |
| US8017445B1 | Warpage-compensating die paddle design for high thermal-mismatched package construction | Electricity | 10 | Active |
| US8106489B1 | Integrated circuit package and packaging method | Electricity | 2 | Active |
| US7608914B1 | Integrated circuit package with electrically isolated leads | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.