Apparatus and method for treating substrate
US8286580B2 · kind B2 · utility
2Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2006 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method that can maintain the temperature of a wafer at a process temperature before a coating process is performed by supplying a photoresist. According to the present invention, a thinner which helps a diffusion of the photoresist is supplied onto the wafer before the photoresist is supplied. The thinner is supplied in a temperature-controlled state such that the wafer has the process temperature by the thinner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.