Patent · US Active

Debris removal in high aspect structures

US8287653B2 · kind B2 · utility

9Cited by
13References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 17, 2007
Grant dateOct 16, 2012
Priority date
Expiry dateAug 15, 2028

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/70925
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A method of debris removal is provided. The method includes positioning a nanometer-scaled tip adjacent to a piece of debris on a substrate. The method also includes adhering the piece of debris to the tip. In addition, the method also includes removing the piece of debris from the substrate by moving the tip away from the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.