Patent · US Active

Sensor chip with connected non-metallic particles comprising a metallic coating

US8288166B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

FUJIREBIO INC. · JP

Inventors

Reiner Dahint · Eppelheim, DE
Petra Bücker · Heidelberg, DE
Elka Trivela · Sofia, BG
Sören Schilp · Mannheim, DE
Michael Himmelhaus · Karlsruhe, DE
Hatice Acunman · Neckargerach, DE

Key dates

Filing date	Apr 21, 2006
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Oct 3, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/554
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention provides a chip comprising a substrate with at least one surface and a layer of particles having a non-metallic core and a coating made of a metal or a metal alloy, characterized in that each non-metallic core, on average, forms a metal-surrounded contact point with at least one other non-metallic core and/or the substrate surface.The invention also provides a method for preparing a chip, comprising the steps of, The chip can be employed in optical devices for the detection of analytes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.