Method for fabricating through substrate microchannels
US8288243B2 · kind B2 · utility
3Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Nov 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming large microchannels in an integrated circuit by etching an enclosed trench into the substrate and later thinning the backside to expose the bottom of the trenches and to remove the material enclosed by the trench to form the large microchannels. A method of simultaneously forming large and small microchannels. A method of forming structures on the backside of the substrate around a microchannel to mate with another device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.