Stuart M. Jacobsen
40Patents
12h-index
33Co-inventors
81Inventor score
Filing activity: Jul 20, 1993 → Jul 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7463118B2 | Piezoelectric resonator with an efficient all-dielectric Bragg reflector | Electricity | 274 | Active |
| US5804919A | Resonant microcavity display | Electricity | 61 | Expired |
| US6529322B1 | High contrast front and rear viewing surfaces for projection displays | Physics | 59 | Expired |
| US6392341B2 | Resonant microcavity display with a light distribution element | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5469018A | Resonant microcavity display | Electricity | 49 | Expired |
| US6698082B2 | Micro-electromechanical switch fabricated by simultaneous formation of a resistor and bottom electrode | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5616986A | Resonant microcavity display | Electricity | 44 | Expired |
| US6198211A | Resonant microcavity display | Physics | 39 | Expired |
| US6404127B2 | Multi-color microcavity resonant display | Emerging Cross-Sectional Technologies | 39 | Expired |
| US6614161B1 | Resonant microcavity display | Physics | 37 | Expired |
| US6326256A | Method of producing a laser trimmable thin film resistor in an integrated circuit | Electricity | 24 | Expired |
| US6497824B1 | One mask solution for the integration of the thin film resistor | Electricity | 12 | Expired |
| US6921962B1 | Integrated circuit having a thin film resistor located within a multilevel dielectric between an upper and lower metal interconnect layer | Electricity | 11 | Expired |
| US6645821B2 | Method of producing a thin film resistor in an integrated circuit | Electricity | 11 | Expired |
| US9896330B2 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Electricity | 9 | Active |
| US9503047B2 | Bulk acoustic wave (BAW) device having roughened bottom side | Electricity | 6 | Active |
| US6737326B2 | Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect | Electricity | 6 | Expired |
| US9929714B2 | Temperature compensated bulk acoustic wave resonator with a high coupling coefficient | Electricity | 6 | Active |
| US9129886B2 | Integrated piezoelectric resonator and additional active circuit | Electricity | 6 | Active |
| US10233074B2 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Electricity | 3 | Active |
| US9240767B2 | Temperature-controlled integrated piezoelectric resonator apparatus | Electricity | 3 | Active |
| US8288243B2 | Method for fabricating through substrate microchannels | Electricity | 3 | Active |
| US10723616B2 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Electricity | 2 | Active |
| US7673972B2 | Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters | Emerging Cross-Sectional Technologies | 1 | Active |
| US7795070B2 | Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.