Conductor removal process
US8288280B2 · kind B2 · utility
1Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2007 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Apr 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the blanket conductor layer entirely over the patterns is oxidized to form a dielectric layer. A CMP step is performed to remove the dielectric layer and a portion of the remaining conductor layer in turn and thereby expose the patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.