Patent · US Active

Package including proximately-positioned lead frame

US8288845B2 · kind B2 · utility

0Cited by

2References

16Claims

0Family size

Assignee

TriQuint Semiconductor, Inc. · US

Inventors

Howard D. Bartlow · Sunnyvale, US
William McCalpin · Sunnyvale, US
Michael Lincoln · Frederick, US

Key dates

Filing date	Nov 14, 2008
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Mar 10, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.