Patent · US Active

Memory device system with stacked packages

US8288860B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

STATS ChipPAC, Ltd. · SG

Inventors

Chee Keong Chin · Shanghai, CN
Yu Feng Feng · Shanghai, CN
Wen Qu · Monterey Park, US

Key dates

Filing date	Sep 9, 2008
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Jun 11, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.