System and method for treating substrate
US8289496B2 · kind B2 · utility
13Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Feb 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67213
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.