Flux-free detachable thermal interface between an integrated circuit device and a heat sink
US8289712B2 · kind B2 · utility
6Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.