System and method for wafer back-grinding control
US8298041B2 · kind B2 · utility
0Cited by
4References
10Claims
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Assignee
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Key dates
| Filing date | Oct 8, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Oct 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.