MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same

US8298847B2 · kind B2 · utility

Assignee

• QUALCOMM MEMS Technologies, Inc. · US

Inventors

• Lior Kogut · Haifa, IL
• Chun-Ming Wang · Fremont, US
• Chengbin Qui · Cupertino, US
• Stephen Zee · San Jose, US
• Fan Zhong · Lo Wu, CN

Key dates

• Filing date: Apr 23, 2010
• Grant date: Oct 30, 2012
• Expiry date: Apr 18, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S359/90
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.