Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
US8298930B2 · kind B2 · utility
15Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor structure includes patterning a barrier layer metallurgy (BLM) which forms an undercut beneath a solder material, and forming a repair material in the undercut and on the solder material. The method also includes removing the repair material from the solder material, and reflowing the solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.