Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
US8298946B2 · kind B2 · utility
2Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2005 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Apr 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also to processes and methods for fabricating microsystems and connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.