Interconnection element for electric circuits
US8299368B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Mar 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0542
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.