Integration of MEMS and CMOS devices on a chip

US8299506B2 · kind B2 · utility

Assignee

• HONEYWELL INTERNATIONAL INC. · US

Inventors

• Andy Peczalski · Eden Prairie, US
• Robert E. Higashi · Shorewood, US
• Gordon A. Shaw · Plymouth, US
• Thomas Keyser · Plymouth, US

Key dates

• Filing date: Dec 1, 2009
• Grant date: Oct 30, 2012
• Expiry date: Dec 17, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/00
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method of forming CMOS circuitry integrated with MEMS devices includes bonding a wafer to a top surface layer having contacts formed to CMOS circuitry. A handle wafer is then removed from one of the top or bottom surfaces of the CMOS circuitry, and MEMS devices are formed in a remaining silicon layer.