Stacked ball grid array package module utilizing one or more interposer layers
US8299594B2 · kind B2 · utility
3Cited by
20References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Aug 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.