Patent assignee · US · COMPANY

Aprolase Development Co., LLC

15Patents
15Active
15Granted
52Portfolio score

Filing activity: Jun 24, 2002 → Jul 12, 2011 · 14 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US8198576B2 Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure Electricity 25 Active
US7919844B2 Tier structure with tier frame having a feedthrough structure Electricity 11 Active
US8074082B2 Anti-tamper module Electricity 7 Active
USRE43722E1 Three-dimensional ladar module with alignment reference insert circuitry General 6 Active
US7902879B2 Field programmable gate array utilizing dedicated memory stacks in a vertical layer format Electricity 4 Active
US8299594B2 Stacked ball grid array package module utilizing one or more interposer layers Electricity 3 Active
US8040022B2 Forced vibration piezo generator and piezo actuator Electricity 3 Active
US8012803B2 Vertically stacked pre-packaged integrated circuit chips Emerging Cross-Sectional Technologies 3 Active
US8485793B1 Chip scale vacuum pump Mechanical Engineering; Lighting; Heating 2 Active
US7990727B1 Ball grid array stack Emerging Cross-Sectional Technologies 2 Active
US7982300B2 Stackable layer containing ball grid array package Electricity 1 Active
US8934627B2 Video event capture, storage and processing method and apparatus Electricity 1 Active
USRE43877E1 Method for precision integrated circuit die singulation using differential etch rates General 0 Active
US8835218B2 Stackable layer containing ball grid array package Electricity 0 Active
USRE43536E1 Stackable layer containing ball grid array package General 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.