Enhanced thermal management of 3-D stacked die packaging

US8299608B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Gerald K. Bartley · Rochester, US
• David R. Motschman · Rochester, US
• Kamal K. Sikka · Poughkeepsie, US
• Jamil A. Wakil · Austin, US
• Xiaojin Wei · Poughkeepsie, US
• Jiantao Zheng · Hopewell Junction, US

Key dates

• Filing date: Jul 8, 2010
• Grant date: Oct 30, 2012
• Expiry date: Dec 31, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/167
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.