Polishing pad, polishing method and method of forming polishing pad
US8303378B2 · kind B2 · utility
0Cited by
16References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 22, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Apr 2, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.