Polishing pad and method of fabrication
US8303382B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2006 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Mar 3, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.