MEMS device assembly and method of packaging same
US8304275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2010 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Jan 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS device assembly (20) includes a MEMS die (22) and an integrated circuit (IC) die (24). The MEMS die (22) includes a MEMS device (36) formed on a substrate (38) and a cap layer (34). A packaging process (72) entails forming the MEMS device (36) on the substrate (38) and removing a material portion of the substrate (38) surrounding the device (36) to form a cantilevered substrate platform (46) at which the MEMS device (36) resides. The cap layer (34) is coupled to the substrate (38) overlying the MEMS device (36). The MEMS die (22) is electrically interconnected with the IC die (24). Molding compound (32) is applied to substantially encapsulate the MEMS die (22), the IC die (24), and interconnects (30) that electrically interconnect the MEMS device (22) with the IC die (24). The cap layer (34) prevents the molding compound (32) from contacting the MEMS device (36).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.