Semiconductor chip thermal interface structures
US8304291B2 · kind B2 · utility
5Cited by
6References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 29, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Jan 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.