Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
US8304666B2 · kind B2 · utility
37Cited by
11References
21Claims
0Family size
Assignee
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Key dates
| Filing date | May 19, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Aug 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.