Inventor · Taipei, TW

Cheng-Ta Ko

55Patents
3h-index
52Co-inventors
65Inventor score

Filing activity: Dec 13, 2007 → May 15, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8304666B2 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof Electricity 37 Active
US8269112B2 Flexible circuit structure Emerging Cross-Sectional Technologies 8 Active
US9373564B2 Semiconductor device, manufacturing method and stacking structure thereof Electricity 3 Active
US8008573B2 Integrated package structure having solar cell and thermoelectric element and method of fabricating the same Emerging Cross-Sectional Technologies 2 Active
US11516910B1 Circuit board structure and manufacturing method thereof Electricity 2 Active
US10658282B2 Package substrate structure and bonding method thereof Electricity 1 Active
US10458893B2 Miniaturized particulate matter detector and manufacturing method of a filter Physics 1 Active
US11445617B2 Package structure and manufacturing method thereof Emerging Cross-Sectional Technologies 1 Active
US9130080B2 Encapsulation of backside illumination photosensitive device Electricity 1 Active
US11460255B2 Vapor chamber device and manufacturing method thereof Electricity 1 Active
US11943877B2 Circuit board structure and manufacturing method thereof Electricity 0 Active
US11764344B2 Package structure and manufacturing method thereof Electricity 0 Active
US11955587B2 Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device Electricity 0 Active
US10588214B2 Stacked structure and method for manufacturing the same Emerging Cross-Sectional Technologies 0 Active
US11424216B2 Electronic device bonding structure and fabrication method thereof Electricity 0 Active
US9931813B2 Bonding structure and method of fabricating the same Emerging Cross-Sectional Technologies 0 Active
US11366381B2 Mask structure and manufacturing method thereof Emerging Cross-Sectional Technologies 0 Active
US8679891B2 Heterostructure containing IC and LED and method for fabricating the same Electricity 0 Active
US11637047B2 Manufacturing method of chip package structure Electricity 0 Active
US10957658B2 Package structure with structure reinforcing element and manufacturing method thereof Electricity 0 Active
US11682612B2 Package structure and manufacturing method thereof Electricity 0 Active
US12185479B2 Flexible circuit board and manufacturing method thereof Electricity 0 Active
US11410940B2 Package structure with structure reinforcing element and manufacturing method thereof Electricity 0 Active
US12243838B2 Circuit substrate structure and manufacturing method thereof Electricity 0 Active
US10756050B2 Package structure and bonding method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.