Integrated circuit package with embedded components
US8304888B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Sep 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.