Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same
US8309219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jul 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.