Light emitting apparatus and fabrication method thereof
US8310037B2 · kind B2 · utility
1Cited by
4References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Feb 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.