Patent · US Active

Heatsink moldlocks

US8310042B2 · kind B2 · utility

1Cited by

4References

5Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Alexander J. Elliott · Tempe, US
L. M. Mahalingam · Scottsdale, US
William Strom · Chandler, US

Key dates

Filing date	Jun 14, 2006
Grant date	Nov 13, 2012
Priority date	—
Expiry date	Jun 4, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination. The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12 do not detract from the purpose of the die attach solder (36).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.