Package-on-package with fan-out WLCSP
US8310051B2 · kind B2 · utility
12Cited by
21References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package includes a package carrier; a semiconductor die assembled face-down to a chip side of the package carrier; a rewiring laminate structure between the semiconductor die and the package carrier; a plurality of bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier; and an IC package mounted on the package carrier. The IC package and the semiconductor die are at least partially overlapped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.