Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
US8312404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | May 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for modeling bond wires in an IC package for predicting noise effects generated by electromagnetic coupling in complex bond wire configurations. A look-up table of equivalent LC circuit models for the bond wires is generated that accurately predicts the effects of the bond wire circuitry of a signal transmission system. Switch and mirror techniques are applied to reduce the bond wire configurations necessary to simulate. The method includes: setting parameters related to the IC package layout of groups of bond wires; sub-dividing each group of bond wires into regions, each including a portion of the bond wire or its corresponding pad, and generating dissection planes for the regions consisting of the bond wires; performing a 3D simulation on the regions consisting of the corresponding pads, and a 2D simulation for each dissection plane; constructing equivalent circuit models for groups of bond wires and corresponding pads based on the 3D and 2D simulations results; inputting the equivalent circuit models into a circuit simulator to measure the noise effects; and modifying the layout geometry to meet noise targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.