Semiconductor manufacturing process modules
US8313277B2 · kind B2 · utility
14Cited by
56References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A variety of process modules are described for use in semiconductor manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.