Patent · US Expired

Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device

US8313892B2 · kind B2 · utility

2Cited by
11References
8Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 7, 2005
Grant dateNov 20, 2012
Priority date
Expiry dateJan 17, 2026

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/095
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Technologies to form fine resist patterns consistently by solving the problem of poor patterning influenced by a resist-protecting film, are provided. A layer made of a resist (resist layer) is formed on a substrate, a resist-protecting film comprising an antistatic resin and a photo-acid generating agent is formed on the resist layer, and active-energy rays are selectively irradiated over the resist-protecting film, so that a resist pattern is formed by developing the resist.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.