Magnetic microelectronic device attachment
US8313958B2 · kind B2 · utility
24Cited by
69References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Jun 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic devices of the microelectronic packages may have magnetic attachment structures comprising a magnetic material formed on an attachment structure. The microelectronic device may be aligned on a substrate with a magnetic field and then held in place therewith while being attached to the substrate. The microelectronic device may also be aligned with an alignment plate which magnetically aligns and holds the component in place while being packaged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.