Method to planarize three-dimensional structures to enable conformal electrodes

US8314400B2 · kind B2 · utility

Assignee

• Lawrence Livermore National Security, LLC · US

Inventors

• Rebecca J. Nikolic · Oakland, US
• Adam Conway · San Francisco, US
• Robert T. Graff · Modesto, US
• Catherine Reinhardt · Livermore, US
• Lars Voss · Livermore, US
• Qinghui Shao · Fremont, US

Key dates

• Filing date: Jan 27, 2011
• Grant date: Nov 20, 2012
• Expiry date: Mar 6, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01T3/08
• WIPO field: Environmental technology
• WIPO sector: Chemistry

Abstract

Methods for fabricating three-dimensional PIN structures having conformal electrodes are provided, as well as the structures themselves. The structures include a first layer and an array of pillars with cavity regions between the pillars. A first end of each pillar is in contact with the first layer. A segment is formed on the second end of each pillar. The cavity regions are filled with a fill material, which may be a functional material such as a neutron sensitive material. The fill material covers each segment. A portion of the fill material is etched back to produce an exposed portion of the segment. A first electrode is deposited onto the fill material and each exposed segment, thereby forming a conductive layer that provides a common contact to each the exposed segment. A second electrode is deposited onto the first layer.