Self-locking features in a multi-chip module
US8315065B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Dec 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.