Dicing method, program for the dicing method, and storage medium for the dicing method
US8316744B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2009 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Apr 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/145
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A dicing method includes the step of cutting a substrate with a blade along a scribe line free from metal before an inclination of the blade surface reaches a predetermined critical value. The blade surface becomes inclined when the blade cuts into a scribe line having metal thereon. The critical value is determined on the basis of the inclination of the blade surface which leads to a breakage of the blade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.