Integration manufacturing process for MEMS device
US8318511B2 · kind B2 · utility
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4References
6Claims
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Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/097
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.