Hsueh-An Yang
19Patents
5h-index
24Co-inventors
62Inventor score
Filing activity: Sep 28, 2004 → Jan 15, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7706149B2 | Micro-electro-mechanical-system package and method for manufacturing the same | Emerging Cross-Sectional Technologies | 33 | Active |
| US7681779B2 | Method for manufacturing electric connections in wafer | Electricity | 24 | Active |
| US8810027B2 | Bond ring for a first and second substrate | Electricity | 7 | Active |
| US8836116B2 | Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates | Electricity | 6 | Active |
| US8277667B2 | Magnetic element and manufacturing method therefor | Electricity | 6 | Active |
| US8368152B2 | MEMS device etch stop | Electricity | 3 | Active |
| US8633554B2 | MEMS device etch stop | Electricity | 2 | Active |
| US7501342B2 | Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same | Electricity | 2 | Active |
| US7651888B2 | Wafer lever fixture and method for packaging micro-electro-mechanical-system devices | Performing Operations; Transporting | 2 | Active |
| US8114699B2 | Integration manufacturing process for MEMS device | Performing Operations; Transporting | 1 | Active |
| US8030111B2 | Integration manufacturing process for MEMS device | Performing Operations; Transporting | 1 | Active |
| US9240348B2 | Method of making a semiconductor device package | Electricity | 1 | Active |
| US7945062B2 | Microelectromechanical microphone packaging system | Electricity | 1 | Active |
| US9502334B2 | Method of making a semiconductor device package with dummy gate | Electricity | 0 | Active |
| US8263493B2 | Silicon chip having through via and method for making the same | Electricity | 0 | Active |
| US7863181B2 | Method for manufacturing a device having a high aspect ratio via | Electricity | 0 | Active |
| US8318511B2 | Integration manufacturing process for MEMS device | Performing Operations; Transporting | 0 | Active |
| US9056766B2 | Method of forming a bond ring for a first and second substrate | Electricity | 0 | Active |
| US7196449B2 | Two-axis device and manufacturing method therefor | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.