Method for providing an energy assisted magnetic recording head in a wafer packaging configuration
US8322022B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jan 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for providing energy assisted magnetic recording (EAMR) heads is described. The method comprises bonding a plurality of lasers to a first substrate. The plurality of lasers corresponds to the plurality of EAMR heads and is for providing energy to a plurality of EAMR transducers. The method further comprises fabricating the plurality of EAMR transducers for the plurality of EAMR heads on a second substrate, bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate, removing at least one of the first substrate and the second substrate, and separating a remaining substrate into the plurality of EAMR heads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.