Ming Sun
120Patents
15h-index
103Co-inventors
89Inventor score
Filing activity: Apr 8, 2003 → Dec 1, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8582238B1 | Systems and methods for providing perpendicular magnetic writers having gradient magnetic moment side shields | Physics | 170 | Active |
| US8451563B1 | Method for providing a side shield for a magnetic recording transducer using an air bridge | Emerging Cross-Sectional Technologies | 157 | Active |
| US8670211B1 | Method and system for providing high magnetic flux saturation CoFe films | Electricity | 153 | Active |
| US8322022B1 | Method for providing an energy assisted magnetic recording head in a wafer packaging configuration | Emerging Cross-Sectional Technologies | 150 | Active |
| US8441756B1 | Method and system for providing an antiferromagnetically coupled writer | Physics | 150 | Active |
| US8760819B1 | Magnetic recording sensor with sputtered antiferromagnetic coupling trilayer between plated ferromagnetic shields | Physics | 140 | Active |
| US8097874B2 | Programmable resistive memory cell with sacrificial metal | Electricity | 90 | Active |
| US7868431B2 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Electricity | 59 | Active |
| US7974117B2 | Non-volatile memory cell with programmable unipolar switching element | Physics | 21 | Active |
| US9817375B2 | Systems and methods for modeling energy consumption and creating demand response strategies using learning-based approaches | Physics | 20 | Active |
| US7776658B2 | Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates | Electricity | 19 | Active |
| US9443541B1 | Magnetic writer having a gradient in saturation magnetization of the shields and return pole | Physics | 18 | Active |
| US8513784B2 | Multi-layer lead frame package and method of fabrication | Electricity | 17 | Active |
| US9305583B1 | Method for fabricating a magnetic writer using multiple etches of damascene materials | Physics | 16 | Active |
| US7622796B2 | Semiconductor package having a bridged plate interconnection | Electricity | 16 | Active |
| US7683464B2 | Semiconductor package having dimpled plate interconnections | Electricity | 15 | Active |
| US8058960B2 | Chip scale power converter package having an inductor substrate | Emerging Cross-Sectional Technologies | 13 | Active |
| US8289751B2 | Non-volatile memory cell with programmable unipolar switching element | Physics | 11 | Active |
| US7857907B2 | Methods of forming silicon nanocrystals by laser annealing | Emerging Cross-Sectional Technologies | 11 | Active |
| US7829989B2 | Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside | Electricity | 10 | Expired |
| US7612439B2 | Semiconductor package having improved thermal performance | Electricity | 10 | Active |
| US8680658B2 | Conductive clip for semiconductor device package | Electricity | 9 | Active |
| US8456903B2 | Magnetic memory with porous non-conductive current confinement layer | Electricity | 9 | Active |
| US8217748B2 | Compact inductive power electronics package | Emerging Cross-Sectional Technologies | 9 | Active |
| US8846532B2 | Method and apparatus for ultra thin wafer backside processing | Electricity | 8 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.