Etching processes used in MEMS production
US8323516B2 · kind B2 · utility
3Cited by
67References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2008 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | May 10, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01D2257/2027
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.