Methods of treating a surface to promote metal plating and devices formed
US8323769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2009 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Dec 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.